Tradelink hosted seminar to introduce its latest digital signing solution – TD-Sign

Tradelink, a leading provider of advanced identity management solutions in Hong Kong, hosted the 'Secure and Embrace the Future: Next-Generation Digital Signing Solutions' seminar on 15th March 2024 at Eaton Club Central. We introduced our latest digital signing solution highlighting its unique features at the event. At the same time, industry experts shared their valuable insights on the diverse applications and benefits of digital signing. The seminar attracted nearly 100 participants including government officials and professionals from the legal, finance and other sectors.

At the seminar, Tradelink's Executive Director & Chief Technology Officer, Mr. Andrew Cheng introduced TD-Sign which enables e-Passport holders to apply and collect Personal (Remote) ID-Cert Class 12, a recognized certificate remotely issued by a recognized certificate remotely issued by Digi-Sign Certification Services Limited ("Digi-Sign") via smartphones, and conduct digital onboarding and signing with the use of the certificate issued. Leveraging the unique status of its wholly-owned subsidiary Digi-Sign as the only commercial Recognized Certification Authority in Hong Kong under the Electronic Transactions Ordinance, Tradelink offers TD-Sign which enables businesses to digitally onboard international customers and facilitate cross-border/global exchange of legally-binding documents. While globally recognized under the Adobe Approved Trusted List, locally, the solution fully complies with the relevant regulatory requirements in Hong Kong. To illustrate the functionality of TD-Sign, Andrew conducted a live demonstration using the solution to digitally sign a Memorandum of Understanding on developing a strategical partnership with Nexify Limited to develop solutions supported by TD-Sign.

Along with Andrew, other keynote speakers of the seminar included Dr. Law Wai Hung, Chairman of the International Dispute Resolution & Risk Management Institute; Mr. Vahid Modares, Lead Solution Engineer at Apryse Software Inc.; and Mr. Bill Wu, Principal Consultant of Research & Product Development at Nexify. They shared a wide range of applications and real-life use cases of digital signatures across different industries.

We are delighted that the seminar received a positive response and generated significant interest in TD-Sign solution among the participants. Moving forward, Tradelink will continue to develop best-in-class solutions and share the latest technology advancements with our partners and industry players through similar events.